Silicone Gel Pad thermal interface conductive gel pad

Introduction
This series of products are resilient, suitable for large institutional design tolerances. Product is Double-layer structure, reinforcing with special ultra-thin fabric. Good resistance to punching, strip type, Malformation designs. Two-sided self-adhesive and never recede. No corrosion to the Copper surface. Completely non-toxic and green products accord to international requirements

Features
Ultra conformability
Designed for low-stress applications
Fiberglass reinforced for puncture, shear and tear resistance

Thermal Conductivity----- W/m*K 2.0, 2.8
Thickness ------ mm 0.3~5.0, 0.3~5.0
Density ------g/cm3 2.7, 3.0
Silicone Gel Pad thermal interface conductive gel pad