Silicone Rubber Pad thermal interface conductive

Introduction
Silicone rubber base with high heat-conducting filling materials. The coefficient of heat conductivity can reach 1.0~ 3.0 W/m.K. This kind of materials offers super heat-conducting property and maintains the cost efficient to customers as well.

Features
High thermal performance, cost-effective solution
Easy to assemble ( 0.1~0.5mm )
Applications
Consumer electronics.
Automotive Systems.
Telecommunications.
Aerospace.
Military.
Medical devices.
Industrial controls.

Thermal Conductivity----- W/mK 1, 1.5, 2, 3, 4.8
Thickness----- mm 0.2~0.5, 0.2~0.5, 0.2~0.5, 0.2~0.5, 0.2~0.5
Specific Gravity----- g/cm3 2.3, 2.5, 2.8, 3, 3.2
Silicone Rubber Pad thermal interface conductive