Introduction
Two part ceramic-filled silicone gels with high thermal conductivity. After mixing, reaction will take place at room temperature or speed up the reaction by heating. No by-product in cure process.
Features
100% solids – no cure by-products
Ultra-conforming
Low-stress applications
Application
Electrical Machinery
Computer and peripheral
Thermal Conductivity----- W/mK 1, 1.8, 2.5, 2.9, 3.2
Specific Gravity ------g/cm3 2, 2.6, 2.8, 3, 3.1
Hardness -------Shore 00 50, 50, 50, 80, 80
Silicone Sealing Compound Gel thermal conductive