Silicone Fiberglass therma interface conductive silicon film

Introduction
Unlike traditional low thermal conductivity fiberglass with ceramic powder filler, XK-F series is a composite of high performance ceramic filler and 30um thin fiberglass, achieving high thermal conductivity on flatness surface with low pressure. Recommended using for TO220/TO3P where insulation is needed.

Features
Elastomeric compound coated on both sides
No oil bleed, long term stability
Electrical insulating

Applications
Power supplies
Automotive electronics
Motor controls
Power semiconductors

Thermal Conductivity----- W/mK 1, 1.5, 2.2, 3.5, 5, 5.8
Thickness----- mm 0.2~0.5, 0.2~0.5, 0.2~0.5, 0.3 / 0.38, 0.2~0.5, 0.2~0.5
Specific Gravity----- g/cm3 2.1, 2.4, 2.7, 1.8, 1.7, 1.6
Silicone Fiberglass therma interface conductive silicon film