Non-Silicone Sealing Compound thermal interface material

Introduction
XK-SN is a good thermal solution for silicone-sensitive applications. The material is supplied as a two-part component, curing at Medium temperatures.

Features
No Siloxane Volatiles
High thermal conductive
Electrical insulating
Applications
Mechanical switching relay
Motor unit.

Thermal Conductivity----- W/mK 0.8, 1.5
Specific Gravity -----g/cm3 1.5, 2.5
Hardness -----Shore D 90, 90
Non-Silicone Sealing Compound thermal interface material