Thermally Conductive Gel

Introduction
Syringes packaging, automated production, high temperature resistance, non-corrosive to metal, 100% thermal curing putty, XK-G series is a silicone based, high performance thermal Gel, filling with a variety of high-performance ceramic powder, possessing the features of high thermal conductivity, low thermal resistance, good insulation, infinite compression.

Features
Excellent compressibility
Very low thermal resistance
Good creep performance
Best for north bridge IC

Applications
Consumer electronics / Automotive Systems/ Telecommunications / Hand-set applications

Thermal Conductivity----- W/mK 1.5, 2, 3.2
Specific Gravity -----g/cm3 2.7, 2.9, 3.1
Flow Rate (30cc EFD cartridges 0.100”orifice 90psi)-----
-----g/min 10, 5, 8
Low Limit BLT Thickness----mm 0.05, 0.05, 0.09
Thermally Conductive Gel