Silicone free Thermal Putty Gel

Introduction
Syringes packaging, automated production, high temperature, non-corrosive to metal, 100% thermal curing putty. XK-GN series is a high thermal performance Gel , it based on TPR, Filled with a variety of high-performance ceramic powder. It also has high thermal conductivity, low thermal resistance, good insulation characteristics .

Features
Good compressibility
Non-silicone
Non-curing
Resists pump-out

Applications
Consumer electronics.
Automotive Systems.
Telecommunications.

Thermal Conductivity----- W/mK 1.4, 2, 3
Specific Gravity -----g/cm3 2.6, 2.8, 3
Flow Rate (30cc EFD cartridges 0.100”orifice 90psi) -----g/min 7, 5, 5
Silicone free Thermal Putty Gel